Survival of the FIT-est: PV industry competition to intensify in 2010 Solar

This article was originally published by RenewableEnergyWorld.com and was reprinted by permission.

by Henning Wicht and Greg Sheppard, iSuppli

The year 2009 was tough on every industry, and the 'hot' solar energy industry wasn't immune to the global recession and the financial market upheaval. And, although 2010 is shaping up to be a better year, it won't be without its challenges. But what are the major business challenges that industry players will face in the coming year and what are their implications?

iSuppli is forecasting that installed capacity of PV systems will grow some 68% in 2010, reaching 8.6 GW globally. This represents a return to growth not seen since the autumn of 2008 as the global recession recedes and as new geographies and segments of demand emerge. But 2009 witnessed tremendous price erosion, with average crystalline module prices down 38%, solar wafer prices down 50%, and polysilicon spot prices down 80%, as shown in Figure 1. We believe this represents a permanent ratcheting down of price structures that will transform the industry into a very competitive market place, with weaker players dropping out and a select few aggregating larger pieces of the market.
Figure 1: PV Price projections 2008-2010.



One of the major implications is that industry players will need to continue to accelerate cost-down roadmaps in an effort to keep up with the price declines and to repair shrinking profit margins. Figure 2 shows operating profit margins for polysilicon, cell/module players, and the so-called integrated players which combine at least four nodes in the chain. After suffering a loss for much of 2009, our analysis suggests that profits will move into the positive in Q4 2009 and continue to improve during 2010. We are projecting that the average will pop back above 10% by Q4 2010 with the over supplied polysilicon area lagging behind in profit strengthening. Our major underlying assumption behind the improvement in the profit picture is due to cost-down programmes catching up with the rate of price declines.

Figure 2: PV industry operating profit margins.



In 2009, the price of an average PV system declined about 11% while the price of an average crystalline module declined 38%. For 2010, system prices are predicted to fall another 10%, while modules will drop another 20%.

There appear to be three drivers for this divergence. One is that prices for the balance-of-system (BOS) elements and installation-related costs (engineering, procurement, and construction (EPC)) are declining more slowly. Another reason rests with the fractured nature of the installation node, where there is less motivation to pass along the cost savings. The third, which is related to the second, concerns the very act of providing incentives for PV electricity projects (feed-in tariffs, rebates, tax credits, etc.) which helps keep system prices higher.

The thinking behind this last point is that project developers and installers just need to show the system owner sufficient ROI and payback periods -- not necessarily the lowest price -- to make the deal. This is made possible by the fragmentation of the installation node of the PV value chain.

There are literally thousands of project developers and installers in the world, most of them not subjected to the intense commodity-like competition that their supply chain faces. This is both a drag on the development of the industry, as well as an opportunity for the best margins in the business.

Why feed-in tariffs really are causing a fit

New entrants on the march

Expect more players to enter the PV space in 2010 as they try to leverage potential competitive advantages from other industries. Top of the list are Samsung and LG Electronics (the largest shareholder of LG Displays), already the world's largest LCD panel makers. These companies have vast experience in bringing down costs, raising quality, and ramping to high volumes. Both these companies can potentially benefit by the procurement leverage of items like glass, wafers, polysilicon, and manufacturing equipment. They are also well versed at moving into areas after they have been established and then eventually dominating them.

LG Electronics has already announced it will start large-scale production in both cells and modules (thin-film and crystalline) from its new 120 MW capacity plant in early 2010. It claims its thin-film technology has 11.1% efficiency.

TSMC, one of the world largest manufacturers of chips and buyers of electronic-grade wafers, has also begun to diversify into PV. Its most significant move to date is taking a 20% stake in cell maker Motech. TSMC is experienced in large-scale manufacturing and cost-reduction programmes, and also has an existing footprint in China. Look for them to bring similar advantages as the Korean giants to the party.

Bechtel, the large EPC firm with more than US$31 billion in annual revenues, has officially entered the solar industry. The company has been contracted to design and install 440 MW of CSP in southern California. Bechtel, a huge private company famous for building airports, dams, and transportation systems, could become a significant player in project development and an entity that many could want to partner with.

The major implication of these new entrants on current industry players is that the latter group needs to watch out. Don't get caught thinking, 'They'll never make it; we're too far down the learning curve to get hurt.' It is simply amazing how hiring the right handful of people and bundling with deep-pocketed capital can change things.


A great deal of uncertainty has been injected into the sector from the world's largest market, Germany. Like Spain last year, the threat of a potential 'additional' reduction in the feed-in tariff (FiT) has created a spike in German market demand for PV systems. Germany will account for 50% of total worldwide PV installations in 2009.

The new government in Germany is assessing the burden posed by the current FiT regime on rate payers and electricity utilities. Current speculation is that by mid-year, an extra lowering of the FiT will have been in the works. This would extend the demand bubble seen in the last few months of 2009 into the first half of 2010. The main implication is continuing tight conditions with regard to supply and firm pricing -- for a while. Then, depending on how 'orderly' the PV industry reacts, there is the potential of another supply glut returning in the second half of 2010. Only the best managed companies will be able to profitably navigate this uncertainty.

It's not by accident that the world's largest solar panel maker, First Solar, is also the lowest-cost high-volume producer. First Solar is a producer of thin-film modules based on CdTe technology. iSuppli predicts the average price gap between thin-film and crystalline technologies will narrow to $0.60/W in 2010 after averaging $0.80/W in 2009. This narrowing gap is a reflection not only of a lot of pain and suffering in the crystalline supply chain, but also of essentially zero profit collectively for those producers. In 2010, crystalline module prices are predicted to drop by another 20% to $2/W and thin-film by 18% to $1.40/W. The major implication of this outcome is that if companies aren't meeting or beating these percentage take-downs, they stand to lose market share in 2010.

New polysilicon technologies like Fluidized Bed Reactor (FBR) and Upgraded Metallurgical Grade (UMG) also found that 2009 was not a kind year. In an era of $400/kg pricing, their potential loomed greatly in 2008. But now that we are entering an era of sub-$50 polysilicon, the reward/risk of these technologies has diminished their near-term commercial potential. For the foreseeable future, FBR and UMG market penetration will be curtailed given that the challenges these technologies present overwhelms their now greatly reduced cost advantages.

Expect the modified Siemens method for polysilicon manufacturing to continue to dominate as numerous capacity expansions become available in the coming two years and as various FBR and UMG projects get delayed or even cancelled. MEMC stands alone as the company that has mastered FBR, while REC is backing away from it. As for UMG polysilicon, different players have resorted to mixing it with higher-priced, higher-purity polysilicon in order to raise its efficiency to more marketable levels. This has contributed to its pricing being even closer to the Siemens-method polysilicon. Of additional note, many cell manufacturers are restructuring and focusing on core competencies and do not have the time or money to follow a new polysilicon path.

Installations in 2010 are projected to grow 68% to 8.6 GW. This is a middle-of-the-road forecast based on a recovering global economy, dropping prices, and continued diffusion into both established and emerging markets. We do not see major barriers in Italy, California/US, France, and Spain. However, Germany, Japan, and China still have pending discussions on rebate programmes and FiTs. Germany will drive the market in the first half of 2010, but the market could face another stall this summer.

The German government is discussing if the current FiT in 2010 will be trimmed even further from the 9% (11% for large installations) reduction in January 2010. Given the large system price decline, a significant adjustment of funding appears reasonable, but any change would create a short-term 'boom' situation before the new FiT applies.

As a result of discussion among politicians and political experts, the government is aware of the negative effects of FiT changes. The latest feedback indicates a more than 20% reduction from the 2009 FIT by July 2010, anticipated as this magazine goes to press.

In any case, as soon as the weather conditions will allow, the German market will surge. If the FiT is indeed trimmed it could drop significantly from 500 MW to 100 MW per month. Meanwhile, PV demand from other countries will not be able to outbalance a German FiT reduction of 20% by mid-2010 (Figure 3) and thus a German FiT penalty could stall the solar market in mid-2010.

Figure 3: Forecast of PV installations in 2010 (assuming additional German FiT penalty by mid-2010)



More efficient solar modules will continue to command price premiums, but suppliers will have less success in getting these prices to stick than in the past. For applications where space is limited or expensive, efficiency will continue to be valued and a premium paid. But this premium will be fleeting as buyer/plant owner expectations are shaped by payback times, initial out-of-pocket expense, and FiT incentives that are ratcheting down in key countries.

The latter point means that upfront costs will become a larger factor in decision making. A major implication of this is that companies and their investors will find greater acceptance of new technology as well as manufacturing breakthroughs that can demonstrate lower, and at least comparable, costs per watt.

Even though the industry has done a good job of reducing its inventories, the improvement is tenuous because of big swings in utilization rates on existing capacity. Inventory is very hard to plan given all the lumpy FiT demand bubbles hitting the industry, with the German market being the latest uncertainty. True, modules are getting absorbed now, but by the middle of the year, the industry could be swamped again with excess.

From polysilicon to modules, companies have curtailed production by idling lines and running fewer shifts. Average capacity utilization across all nodes is estimated at 70% in 2009. Some companies were sold out all year, while others where swimming in excess. In addition, there were many capacity expansions during the year. And, while there is a lot of debate on how to measure capacity, our definition assumes 24/7 utilization of lines/equipment that is already in place.

We believe excess capacity in 2010 will keep prices flattened (at least, not raising them).


Enter the dragon, the eagle and others


For 2010 we expect several significant new geographic growth markets to be fought for. Most significant are China, the United States and Italy, which are predicted to collectively account for 50% of the growth that takes place in 2010. Germany will remain the biggest market, but these other countries will rise in importance during the year. China is the latecomer as it races to inject more renewable content into its energy portfolio.

Companies positioned strategically in these markets now stand the greatest chance of grabbing share over the next years. Even though local manufacturing can help provide competitive advantage, it is not as crucial as before as module prices have dropped precipitously. So far, the reduction of shipping and other logistics-related charges -- as well as the availability of government incentives -- has not proven motivation enough for setting up local production for many firms.

In the meantime, some companies are using electronics manufacturing service providers to build modules. In two to three years, however, the 'landed costs' of logistics and localization incentives will become larger factors.

Consequently, markets that pass the 500 MW annual total market shipment level should see more investment in module production in the coming years.

Continuing the trend begun in earnest during 2009, more PV industry companies are expected to shift closer to adding value for the users of PV electricity. PV supply chain companies are investing directly into long-term and development-time ownership of solar installations as well as taking control of EPC or installation services. Prime examples are MEMC buying SunEdison and LDK investing in solar farms in China.

One company, Conergy, has turned from being a supply chain player to being a project developer. There are multiple benefits to this downstream focus, including creating more developed sales channels, creating your own customer, and in some cases (but not all), improving profitability.



Henning Wicht and Greg Sheppard are respectively senior director and principal analyst, photovoltaics, and chief research officer for iSuppli. e-mail: hwicht@isuppli.com

This article is an excerpt from the iSuppli Market Tracker report, "The Business of Photovoltaics in 2010," released in February 2010.


SMD, 5.5세대 AM OLED 라인 기공식 OLED

삼성모바일디스플레이(대표 강호문)는 22일 세계 최대 규모인 5.5세대 능동형(AM) 유기발광다이오드(OLED) 라인 기공식을 개최했다.

충남 아산시 탕정에 위치한 삼성디스플레이단지에서 열린 이날 기공식에는 강호문 사장을 비롯해 장원기 삼성전자 LCD사업부 사장, 최치헌 삼성SDI 사장, 이헌식 삼성코닝정밀소재 사장, 박기석 삼성엔지니어링 사장과 임직원 300여명이 참석했다.

13만8600㎡(약 4만2000평) 부지에 총 2조5000억원을 들여 건설하는 이번 5.5세대 AM OLED 라인은 내년 7월부터 본격 가동될 예정이다. 생산 캐파는 1300×1500㎜ 사이즈 유리기판을 월 7만장 양산할 수 있어 모바일용 3인치 패널을 월 3000만개 양산할 수 있는 규모다.

삼성모바일디스플레이는 향후 시장 성장에 맞춰 2012년까지 점진적으로 생산량을 늘리고, AM OLED TV 시장 선점을 위한 대형 패널 양산도 추진한다는 계획이다.

강호문 사장은 기념사에서 “이번 투자는 프리미엄 디스플레이 시장에서 압도적인 경쟁력을 확보하고 존경받는 100년 기업으로 지속 성장하는 발판이 될 것”이라고 말했다.

양종석기자 jsyang@etnews.co.kr

LG aggressive in LED investments to ensure supply for TV business, says Digitimes Research LED

Willie Teng, DIGITIMES, Taipei [Friday 18 June 2010]

With the top-five LCD TV brand vendors expecting LED-backlit LCD TVs to contribute a substantially larger percentage of sales in the coming years, LED players of all levels of the supply chain are actively using strategic alliances and investments to strengthen their positions in the sector.

LED TV's share of the overall LCD TV market will spike to 34% by year's end from 6% currently, according to Digitimes Research.

The LG group is one of such companies. Its flagship company and the world's second largest LCD TV vendor, LG Electronics, projects LED TV will represent 20% of revenues in 2010 with shipments of 6.5 million units, and up to 45% in 2011. Its portfolio also includes LED lighting devices, another fast-growing market.

Though rising demand of LED TVs is indeed good news, it translates to higher pressure to secure sufficient and cost-effective supplies of LED chips and components since competing vendors are expecting huge jumps in LED TV demands as well.

LED TV

Source: Companies, compiled by Digitimes, June 2010

LCD TV

Source: Companies, compiled by Digitimes, June 2010

The LG group has leveraged its resources, both internal and external, to ensure upstream support in anticipation for the demand boom of LED applications, said Digitimes Research analyst Jessie Lin. A good example is the announcement in early June that LG Display, Amtran Technology and Everlight Electronics will set up a LED packaging joint venture in Wujiang City of China's Jiangsu Province.

The new venture is a beneficial move for all parties involved. LG Display, also under the LG group, will form a tighter alliance with Amtran, an important LCD panel client, and secure LED chip and packaging capacity for LG Electronics since Everlight is a major player in the LED chip supply chain.

Amtran manufactures LCD TVs for its affiliate Vizio, currently the sixth largest LCD TV vendor globally. With Vizio aiming to sell 1.5 million LED TVs in 2010, Amtran is also under pressure for stable panel and LED supplies. The joint venture is certainly a strategy to solve both issues, said Lin.

For LED chip packager Everlight, the alliance with LG Display and Amtran enables the company to basically receive commitment for orders from and shipments to two of the world's largest TV vendors prior to any actual capacity increase, which is always a good method to limit expansion risk, the analyst commented.

LED packaging joint venture of LGD, Amtran and Everlight

Facts of the new company

Announcement time

Early June of 2010

Total investments

US$30 million

Stakes

Everlight 60%, LG Display 20%, Amtran 20%

Volume production schedule

December 2010

Capacity

100 million units initially and up to 200 million in 2011.

Location

Wujiang City, Jiangsu Province, China

Products

LED TV BLU

Source: Companies, compiled by Digitimes, June 2010

Internally, the LG group has aggressively ramped up LED chip production and packaging capacity via subsidiary LG Innotek, which in the past was not considered a major player in the LED sector. The company purchased 50 MOCVD machines in 2009 and another 50 are expected for 2010.

In 2010, LED business is projected to bring in 800 billion won (US$650 million) in revenues, up 174% from 2009, for LG Innotek. For the first quarter, its LED business posted 155.1 billion won in sales.

MOCVD procurement by panel makers' subsidiaries, 2009-2010 (units)

2009

2010

Samsung LED (Samung subsidiary)

70

120

LG Innotek (LG subsidiary)

50

50

Lextar (AUO subsidiary)

15-20

60-70

Source: Companies, compiled by Digitimes, June 2010

Despite the rapid equipment procurement, LG Innotek has to continue outsourcing both LED chip production and packaging to fulfill orders.

The entire process of setting up a new MOCVD machine, turning raw materials into a LED chip, delivering the chip for packaging, using it in a back-light unit (BLU) for an LED TV and distributing the TV into sales channel typically takes up to 10 months, according to the Digitimes Research analyst. Therefore, many LG Innotek's MOCVD machines that are going online this year will not be able to actually benefit LG Electronics until 2011.

LG Innotek sources LED chips from Toyoda Gosei, Samsung LED, Seoul Opto Device, Epistar and Formosa Epitaxy, and chip packaging from Everlight, Seoul Opto Device, Wooree LED and Heesung.

LG Group's LED investments, 2008-2010

Date

LG subsidiaries

Investments and alliances

2008

LG Display

Invested in Wooree ETI to secure LED component supply from subsidiary Wooree LED

Jul 2009

LG Innotek

Signed MOU with local government of Gwangju, South Korea to invest 151.3 billion won in the region to expand LED chip production and packaging capacity

2009

LG Innotek

Capex for LED business totaled 400 billion won

Nov 2009

LG Display

Partnered with Formosa Epitaxy, Amtran and Unity Opto to set up LED facility in Yangzhou, Jiangsu Province

2010

LG Innotek

800 billion won capex for LED business

Source: Companies, compiled by Digitimes, June 2010


EUV Lithography: Ready for 2015? Memory in general

The industry is counting on EUV – Will it be ready In time?

By David Lammers

June 3, 2010 – Semiconductor companies are counting on EUV lithography to be ready by 2015 for high-volume manufacturing. With early adopters now using high-k dielectrics in the gate stack, the next grand challenge facing the chip industry is to transition to EUV for the critical layers of memory and logic chips made roughly five years from now. While ASML is making impressive progress – the Dutch company expects to ship six EUV NXT: 3100 scanners beginning later this year for process development – questions remain whether the source and mask infrastructures will be fully ready in time.

To make EUV attractive for volume manufacturing, throughput needs to approach the 150-180 wafers-per-hour levels of today’s immersion 193 nm immersion scanners. For EUV, throughput largely depends on source power, which determines the ability to generate enough of the 13.4 nm-wavelength photons to quickly expose circuit patterns.

Cymer Inc. (San Diego) and Gigaphoton Inc. (Oyama, Japan) are providing laser-produced plasma (LPP) sources, with Cymer supplying ASML with the sources for its EUV scanners. Other companies are developing dipole-produced plasma (DPP), though their demonstrations have been less public.

Will LPP sources be powerful enough to meet EUV’s throughput goals? Nigel Farrar, vice president of strategic applications at Cymer, said observers should be careful to distinguish between “raw” EUV source power and “clean” power at the intermediate focus. Raw power is what the source delivers before it is filtered for spectral purity and dose control.

EUV lithography uses a series of reflective optics and 13.4 nm wavelength light to image patterns on a wafer. (Source: Obert Wood, GLOBALFOUNDRIES, at Sematech Litho Forum)

 

Farrar said Cymer is pursuing several methods to sharply boost source power this year and next. The source power’s efficiency is improved if the laser is timed to hit smaller tin droplets, measuring 30 micrometers in diameter. And Farrar said the pulse length of the CO2 laser will need to approach 400 ms if the sensitivity of the resist can be improved to 10 mJ, but even longer bursts will be needed if the resist sensitivity is in the 30 mJ range. Debris mitigation is another challenge, as the tin debris can damage the expensive collector mirrors and shorten the working lifetime of the optics. Farrar said the company has proprietary solutions for this problem.

Cymer remains confident it can meet the roadmap set by ASML. “Our intent,” Farrar said, “is to upgrade to the full power requirements, starting with a 100W source for the ASML 3100 scanners.” Asked about the roadmap for the NXT: 3300 EUV scanners which ASML plans to sell beginning in 2012 for full chip manufacturing, Farrar said “we are heavily in the co-design stage with ASML on the NXT: 3300.”

Nikon Corp. is also developing an EUV scanner, set to debut in 2014-15 for high-volume manufacturing at the 15 nm node, said Toshikazu Umatate, a vice president at Nikon’s lithography unit.

Another technical challenge facing EUV lithography revolves around the masks, which in EUV’s case are MoSi multi-coated reflective surfaces with the patterns deposited conventionally on the mask blanks. If any particles stick to the multi-coatings of silicon and molybdenum as they are deposited, the resulting bump on the mask blank can make it unusable. Some defects are repairable with ion beam milling. One encouraging sign is that Intel Corp.’s mask shop has created a defect-free EUV mask by positioning the pattern in places where there are no pits or bumps, and completely repairing other defects.

At the recent Sematech Litho Forum in New York City, Obert Wood, the GLOBALFOUNDRIES staff member who is the EUV project leader at the IBM-led Fishkill Semiconductor Alliance, said: “The EUV source power and mask defects are not there yet. But with EUV we can resolve spaces of 20 nm between the contact holes with near-perfect alignment.”

It is the sheer technical power of EUV, and its ability to be extended with up to 0.7 NA optics and 6.8 nm wavelength radiation, that has caused most of the industry’s lithography R&D budget to go towards EUV. Comparing what is possible with double patterning using 193 nm immersion scanners, Wood said that while double-patterning will work for the 40 nm half-pitch generation, it runs into resolution problems at the next technology generation. Particularly for DRAMs, with their two-dimensional structures, EUV may be a necessity on both technological and cost considerations.

EUV Throughput: EUV throughput depends on sharply boosting the source power over the next three years. (Source: Obert Wood, GlobalFoundries, at Sematech Litho Forum)

John Warlaumont, vice president of advanced technology at Sematech’s Albany site, said at the Litho Forum that in previous years the semiconductor industry has debated whether EUV or other options such as direct-write E-beam would carry the industry in 2015 and beyond. “There is less of that now, and more of a discussion about how to make EUV a success. When chip companies look at double-patterning, there are cost and extendibility issues, so companies want to pull EUV in. But sooner doesn’t come for free, and the question now is how to get the whole industry to pay for it,” Warlaumont said.

Lithography at SEMICON West 2010

Don't miss Advanced Lithography, Wednesday, July 14, 2:00pm–4:30pm, at the TechXPOT located in North Hall at Moscone Center. Admission to all technical sessions at the TechXPOT are free to registered SEMICON West attendees.


Report: Samsung supplied ARM core in Apple iPad Memory in general

Samsung Cortex A8 core at heart of Apple's A4 chip

EE Times


SAN JOSE, Calif. — Korea's Samsung provided the ARM core at the heart of the Apple A4 processor that powers the iPad, according to an analysis of the two company's latest chips. The news highlights the growing competition in the expanding mobile market between Samsung and Intel and their ARM and x86 architectures.

The 1 GHz ARM Cortex A8 core found in the Apple iPad's A4 processor is identical to the core in Samsung's S5PC110A01, the application processor in the Korean giant's recently released Wave S8500 smartphone, according to an analysis from UBM TechInsights. The business unit is a division of United Business Media, the publisher of EE Times.

UBM TechInsights found the ARM cores in the Apple A4 and Samsung apps processor are identical

“Not only is Samsung the manufacturer of both application processors, but both application processors feature the same 1 GHz ARM Cortex A8 core manufactured using a 45-nanometer low-power process," said Young Choi, a senior manager at UBM TechInsights who published an analysis of the A4. “With this discovery, we are beginning to see how Samsung is successfully asserting itself as the leader in the wireless and mobile applications processor market,” he said.

Indeed both Samsung and Intel have competed in recent years for design wins in Apple products. To date, Intel has commanded the sockets in Apple Macintosh computers and Samsung dominates in iPod, iPhone and now the iPad.

At Computex in Taipei, Intel announced plans for a next-generation integrated Atom chip targeting netbooks and tablets. Acer said it will use Atom and Intel's MeeGo mobile Linux software in future tablets.

The Apple A4 is expected to be inside the new iPhone announced by Apple Monday. Samsung's next generation phone, the Galaxy S is expected to use the S5PC110A01 and run Google Android.

With these design wins in hand, Samsung is expected maintain its position as the market leader in application processors that it originally attained in 2009, according to UBM TechInsights.

The Samsung S5PC110A01 uses a 512 Kbyte L2 cache and incorporates the PowerVR SGX 3-D graphics core from Imagination Technologies.



AUO revenues grow in May 2010 with record large-size LCD shipments Flat panel in general

Rodney Chan, DIGITIMES, Taipei [Monday 7 June 2010]

Taiwan-based LCD panel maker AU Optronics (AUO) has announced that its May 2010 consolidated revenues grew 6.4% sequentially and 57.9% on year to NT$43.792 billion (US$1.35 billion), with large-size panel shipments hitting a monthly record.

Large-size panel shipments for the month exceeded 10.23 million units, rising by 6% from the previous month, according to the company. Shipments of small- to medium-size panels amounted to 18.54 million units, down 12.2% on month.

AUO: Consolidated revenues, May 2010 (NT$m)

Consolidated

Unconsolidated

May 2010

43,792

41,474

April 2010

41,154

39,012

M/M

6.4%

6.3%

May 2009

27,728

27,421

Y/Y

57.9%

51.2%

Jan-May 2010

196,510

186,728

Jan-May 2009

102,828

101,963

Y/Y

91.1%

83.1%

Source: Company, compiled by Digitimes, June 2010


ProMOS May revenues down on DDR2 price slump DRAM

Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Monday 7 June 2010]

ProMOS Technologies has reported a sequential sales drop for May 2010, due to sluggish prices for DDR2 chips.

ProMOS saw May revenues slide 8.2% on month to NT$2.05 billion (US$63 million). The DRAM maker said its overall output started to increase substantially in May, but weakening DDR2 prices caused revenues for the month to drop slightly.

ProMOS will not kick off mass production of 2Gb DDR3 chips using Elpida Memory's 63nm process until August, the Taiwan DRAM maker was quoted in previous reports.

In related news, average spot prices for eTT 1Gb DDR2 chips grew to US$2.39 on June 4, after having slid to US$2.10 on June 1, according to DRAMeXchange. Meanwhile, prices for eTT 1Gb DDR3 rose to US$2.60 last Friday from US$2.55 Tuesday.

Major Taiwan DRAM makers: Revenues, May 2009 - May 2010 (NT$m)

Month

Nanya

Inotera

Rexchip

PSC

ProMOS

Sales

Y/Y

Sales

Y/Y

Sales

Y/Y

Sales

Y/Y

Sales

Y/Y

May-10

5,267

82.2%

3,912

56.5%

4,587

8,136

440.1%

2,045

185.2%

Apr-10

5,221

97.3%

4,258

78.4%

4,623

7,531

613.6%

2,227

228.2%

Mar-10

5,257

136.8%

4,140

129.2%

4,274

6,846

572%

1,816

194.6%

Feb-10

4,141

112.6%

3,360

46.6%

3,975

5,517

323.8%

1,213

99.6%

Jan-10

4,722

135.7%

4,019

78.1%

3,909

5,932

270.1%

1,245

110.7%

Dec-09

4,964

246.9%

4,668

136.8%

 

 

5,515

320.8%

1,215

55.3%

Nov-09

6,051

314.3%

4,319

41.1%

 

 

5,380

222.2%

1,079

(21.2%)

Oct-09

5,675

75%

3,760

16.8%

 

 

4,239

62.9%

1,042

(48%)

Sep-09

4,559

38.6%

3,480

3.7%

 

 

3,312

(13.3%)

1,013

(61.9%)

Aug-09

3,654

(7.7%)

3,180

(13.3%)

 

 

2,641

(47.6%)

880

(71.9%)

Jul-09

3,296

(22.5%)

2,879

(23.5%)

 

 

1,476

(75.8%)

853

(76%)

Jun-09

2,548

(27.2%)

2,575

(29.1%)

 

 

2,124

(65.8%)

742

(78.9%)

May-09

2,891

(13.1%)

2,500

(24.5%)

 

 

1,506

(75.4%)

717

(78.4%)

*Figures are not consolidated
Source: TSE, compiled by Digitimes, June 2010


AUO and Sunpower to jointly set up solar cell plant in Malaysia Solar

Nuying Huang and Susie Pan, Taipei; Willie Teng, DIGITIMES [Friday 28 May 2010]

The board of directors of AU Optronics (AUO) on May 27, 2010 approved plans to jointly set up a high-efficiency solar cell plant in Malaysia with US-based Sunpower. AUO and Sunpower will contribute US$350 million each to the joint venture and expect volume production to begin in the fourth quarter and capacity to total 1.4GWp in three to four years, according to the company.

AUO has been quite active since its foray into the solar sector. In 2009, AUO invested US$357.5 million to acquire a 65.57% stake in M.Setek, and has since announced an additional investment of US$167 million to the Japan-based poly-Si producer in January 2010. AUO is also cooperating with solar installation companies in Germany, and expanding solar module capacity in Taiwan, China and the Czech Republic. It recently constructed a solar cell plant with a capacity of 30MWp also.

The AUO-Sunpower alliance is seen as highly complementary for both sides. AUO has found an entry into high-efficiency solar cell manufacturing, which requires much more advanced technology, industry sources said. Sunpower possesses patents in back contact solar cells, the technology behind its success in providing the highest efficiency rate commercially available to date.

However, higher conversion rates translate to higher production costs, which is one of the reasons Sunpower has turned in performances below market expectations despite a ferocious demand rebound since 2009.

In return for sharing its intellectual property, Sunpower is hoping AUO's experience in volume production can improve its cost control, the sources said. Sunpower currently has 600MWp of capacity for high-efficiency solar cells.

Sunpower, perhaps realizing the cost issue, recently sourced conventional solar modules which it marketed under the Serengeti brand. The move sent shockwaves through the sector since Sunpower is considered the vanguard in high-efficiency solutions, which solar companies in the US and Europe are hoping to rely on to prevent price wars as China-based players continuously ramp up capacity.

Industry watchers believe AUO's acquisition of M.Setek also played a key role in the alliance. The Japan-based company has been Sunpower's long-time supplier of N-type solar wafers, a material in back contact solar cells production


DRAM maker Inotera to migrate to 42nm process in September DRAM

Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Friday 28 May 2010]

DRAM maker Inotera Memories plans to migrate to a 42nm process in September 2010, two months ahead of its original schedule, according to company chairman Jih Lien. Lien also confirmed previous reports that it would again raise its capex budget for 2010, without disclosing more details.

Market watchers speculate Inotera is likely to revise its 2010 capex to NT$57 billion (US$1.763 billion). The DRAM maker in January upwardly adjusted its capex for the year to NT$52 billion, from an initial goal of NT$45 billion.

Inotera expects to see its 50nm production ramp reflect in its financial figures starting from the third quarter, Lien indicated. Half of its output will be 50nm-made products in the third quarter, which helps lower production costs significantly, Lien added.

Inotera slipped back into the red in the first quarter due to production losses incurred from its process transition from trench to stack technology. The company was quoted in previous reports saying it began ramping production using 50nm stack process in April.

Inotera president Charles Kao noted that the company intends to move up its schedule to deploy 42nm technology, in order to bring itself closer to Samsung Electronics. Production is expected to kick off in small volume at the end of 2010.

Inotera will have around 10 sets of immersion scanner equipment settled at its fabs by the end of the year, according to Kao.

Inotera is a DRAM-manufacturing joint venture between Micron Technology and Nanya Technology, and now runs two 12-inch fabs with a combined capacity of 130,000 wafers per month.

In addition, Kao commented that Samsung's chip capex for 2010 is targeted at taking on Toshiba in the NAND flash segment instead of ramping up substantially of its DRAM chips, and the Korea-based vendor is also seeking to boost its foundry operations. The impact of Samsung's capacity ramp on the global DRAM market should be lower than expected, Kao believes.


Who'll provide the power behind the mainstream business tablet? Memory in general

 

I recently got An iPad to try as part of our analysis work on the Apple tablet, and it is becoming apparent to me that devices of this class will grow to be as popular as the current crop of e-mail-enabled smartphones.

Today we all carry our BlackBerries from meeting to meeting. Soon we'll be toting far more powerful devices-ones that will be at home in the netbook's current market space while also performing some of the tasks now assigned to laptops.

The emerging platforms-including tablets that can be docked to a keyboard and clamshell designs with two screens, such as the MSI prototypes demonstrated at the International Consumer Electronics Show-promise to revolutionize electronic support of collaborative work.

Several questions about these devices come to mind. Who will own the major sockets once tablets enter the mainstream? Whose CPU will be the go-to processor for powering such a device-will it be Intel's Atom, or will ARM find its cores in use? Which companies and technologies should we be watching?

When I got the iPad, Acer's Aspire One netbook had already been collecting dust in my desk drawer for more than a year. I had never made good use of the Acer netbook; the screen felt small and clumsy, with its Windows panels and other accessories, and even for casual Web browsing, I preferred my larger laptop.

The iPad manages screen real estate much more carefully. The ability to rotate the screen to find the right orientation for the task at hand is a great feature; combined with Apple's famous interface to pan and zoom via touchscreen finger gestures, it allows me to browse almost as comfortably as I can when using my 24-inch desktop monitor.

But would the iPad have enough power to enable me to work with business applications, which nowadays are predominantly Web-based? To determine this, I ran some software-based system testing.

I first pointed the iPad to the well-known SunSpider JavaScript benchmark, a test designed to measure a browser's JavaScript execution performance. The tablet executed the test in 10.2 seconds.

I then ran the same test on the Aspire One, and the result was 20.7 seconds. Disappointing, considering that the Atom N270 used n the Aspire One is still found in plenty of netbooks, and, according to CPUBenchmark.net, the modern Z and N series CPUs for netbooks and mobile Internet devices are pretty much comparable to the N270.

Next, I ran Google's V8 test suite and got an even bigger difference.

Whereas SunSpider code measures the cumulative time to run the test, the Google V8 test suite computes the inverse of the geometric mean of multiple test components. Essentially, the SunSpider test measures "how slow," while the Google V8 test measures "how fast." For the V8 test, the more points, the better. The iPad scored 97.8 points and the Aspire One a mere 21.6.

The intimal tests on the Aspire One were done using the default Microsoft Internet Explorer browser. I subsequently installed Apple's Safari on the Acer device, and the netbook sped up like a Ferrari: The SunSpider test took a mere 2.8 seconds, and Google V8 scored 446 points.

At the end of the day, the Aspire One is more than four times faster than the iPad, provided you change the default IE browser to Safari or something comparable; otherwise, the Acer netbook is two times slower than the Apple tablet.

Considering both benchmarking results and the browsing experience, the Atom-powered netbook with default IE8 has severe performance limitations when using rich Web applications, while the ARM-powered iPad is quite adequate with Safari. The Atom processor's speed advantage seems to be lost as soon as you run certain Microsoft software on it (.net and IE).

Indeed, for Web applications the IE engine is substantially slower than virtually anything else on the market. Microsoft has promised to improve the speed in IE9. But the increase might come at the expense of other features, such as security.

I also ported Netlib's Whetstone and Dhrystone to the iPhone software development kit and to Microsoft Visual Studio. For the Microsoft platform, I compiled them both into .net and native code. Dhrystone is a fixed-point test; Whetstone focuses on floating-point. In modern computing, serious number crunching ought to be done in optimized primitives libraries (vector operations, compression, image and voice coding, BLAS, cryptography, XML parsing, regular expression parsing and the like), so I used single precision for the Whetstone test. The results are shown in the table below.

An interesting benchmark published in IEEE Journal suggests the recent ARM-based Tegra 2 outperforms recent Atoms.

Benchmarking is good, but today two things matter more in terms of performance: the speed of primitives, and the speed of bytecode (potentially, JITcompiled) written in Java, C#, Python, Perl or Flash (increasingly used to drive business logic and tie together primitives in multimedia application and games).

The Apple SDK provides for native, noninterpreted code using a rapid application development (RAD) environment, whereas on most other platforms (Android, Windows, webOS, Google applications), RAD normally involves some sort of bytecode. The two noticeable exceptions are the QT library, currently owned by Nokia, and Apple's SDK. This is why code compiled in Apple's RAD tool outperforms code produced by Microsoft's RAD tool.

Nonetheless, my feeling is that bytecode will still be the choice for the majority of business logic. It will be interesting to compare the performance of the ThumbEE/Jazelle-enabled ARM platform with a recent Atom for Java and .net (for Atom only). I believe that ARM received a major competitive advantage through its years of work on bytecode acceleration (Jazelle) and JIT execution (ThumbEE).

On the primitives side, Intel's open-source OpenCV and threading building blocks are widely used. Intel has the outstanding Integrated Performance Primitives, Math Kernel Libraryand XML Parsing Accelerator, but the blocks are not part of any popular development platform; each must be purchased separately.

When we develop for the Intel platform, we want the code to be compatible not only with Intel processors, but with others (such as those from AMD and Via Technologies) as well. In order to leverage the platform fully, Intel or and Microsoft must take the lead, standardize an accelerated primitives API across IA-32/IA-64 platforms and make sure that it is available in all deployments and development tools.

The only primitives library for ARM that I am aware of is Accelerate, from the upcoming Apple iPhone SDK 4.0. In my view, ARM has a small-investment/big-payout opportunity. It can provide the development community with a comprehensive set of accelerated primitives, aligned with different levels of ARM CPUs currently deployed.

Further, ARM should play a more active role in the GNU Compiler Collection (GCC) project, which is essential for the ARM development ecosystem.

The sooner ARM realizes that it needs to cater not just to the OEMs that license its cores but to the development community and tool-chain ecosystem at large, the faster it can protect its "phone and below" market dominance while expanding toward mobile Internet devices and tablets.

At this point, it is hard to predict whether ARM or Intel will prevail in powering the mainstream tablet market. In addition to performance and power consumption, business factors as well as the overall ecosystem are going to play a substantial role in the outcome.

I believe both ARM and Intel should give more focus to the overall ecosystem (accelerated primitives, effective compilers capable of using extended instruction sets, standard APIs for power management, multicore performance) if they hope to fully leverage the technologies already implemented in silicon.


Vyacheslav Zavadsky is a program manager in the technology and product development group at UBM TechInsights, responsible for software analysis services and the software used for design analysis of ICs. He has a PhD in mathematics and an MSc in computing science.


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